Products Learn & Develop Support Support Home Product Specifications Processors Search specifications Add to Compare Intel(R) CoreTM i7-6700 Processor 8M Cache, up to 4.00 GHz Specifications Export specifications Essentials Essentials Product Collection 6th Generation Intel(R) CoreTM i7 Processors Performance Supplemental Information Code Name Products formerly Skylake Memory Specifications Vertical Segment Desktop Graphics Specifications Processor Number i7-6700 Expansion Options Status Launched Package Specifications Advanced Technologies Launch Date Q3'15 Security & Reliability Lithography 14 nm Ordering and Compliance Benchmarks Compatible Products Downloads and Software Included Items Thermal Solution - E97379 Recommended Customer Price - Performance # of Cores 4 # of Threads 8 Processor Base Frequency 3.40 GHz Max Turbo Frequency 4.00 GHz Cache 8 MB SmartCache Bus Speed 8 GT/s DMI3 TDP 65 W Supplemental Information Embedded Options Available Yes Conflict Free Yes Datasheet View now Learn how Intel is pursuing conflict-free technology. Memory Specifications Max Memory Size (dependent on memory type) Memory Types Max # of Memory Channels Max Memory Bandwidth ECC Memory Supported 64 GB DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V 2 34.1 GB/s No Graphics Specifications Processor Graphics Intel(R) HD Graphics 530 Graphics Base Frequency 350 MHz Graphics Max Dynamic Frequency 1.15 GHz Graphics Video Max Memory 64 GB Graphics Output eDP/DP/HDMI/DVI 4K Support Yes, at 60Hz Max Resolution (HDMI 1.4) 4096x2304@24Hz Max Resolution (DP) 4096x2304@60Hz Max Resolution (eDP - Integrated Flat Panel) 4096x2304@60Hz Max Resolution (VGA) N/A DirectX* Support 12 OpenGL* Support 4.4 Intel(R) Quick Sync Video Yes Intel(R) InTruTM 3D Technology Yes Intel(R) Clear Video HD Technology Yes Intel(R) Clear Video Technology Yes # of Displays Supported 3 Device ID 0x1912 Expansion Options Scalability 1S Only PCI Express Revision 3.0 PCI Express Configurations Up to 1x16, 2x8, 1x8+2x4 Max # of PCI Express Lanes 16 Package Specifications Sockets Supported FCLGA1151 Max CPU Configuration 1 Thermal Solution Specification PCG 2015C (65W) TCASE 71C Package Size 37.5mm x 37.5mm Low Halogen Options Available See MDDS Advanced Technologies Intel(R) OptaneTM Memory Supported No Intel(R) Turbo Boost Technology 2.0 Intel(R) vProTM Technology Intel(R) Hyper-Threading Technology Yes Yes Intel(R) Virtualization Technology (VT-x) Yes Intel(R) Virtualization Technology for Directed I/O (VT-d) Yes Intel(R) VT-x with Extended Page Tables (EPT) Yes Intel(R) TSX-NI Yes Intel(R) 64 Yes Instruction Set 64-bit Instruction Set Extensions SSE4.1/4.2, AVX2 Idle States Yes Enhanced Intel SpeedStep(R) Technology Yes Thermal Monitoring Technologies Yes Intel(R) Identity Protection Technology Yes Intel(R) Stable Image Platform Program (SIPP) Yes Security & Reliability Intel(R) AES New Instructions Yes Secure Key Yes Intel(R) Software Guard Extensions (Intel(R) SGX) Yes Intel(R) Memory Protection Extensions (Intel(R) MPX) Yes Intel(R) OS Guard Yes Intel(R) Trusted Execution Technology Yes Execute Disable Bit Yes Intel(R) Boot Guard Yes More support options for Intel(R) CoreTM i7-6700 Processor (8M Cache, up to 4.00 GHz) Product Support Downloads and Software Support Community Warranty and Replacement Need more help? Contact support Give Feedback All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems. Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction. Refer to Datasheet for formal definitions of product properties and features. "Announced" SKUs are not yet available. Please refer to the Launch Date for market availability. Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i72675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update. This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration. "Conflict free" and "conflict-free" means "DRC conflict free", which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers. See http://www.intel.com/content/www/us/en/architecture-and-technology/hyper-threading/hyper-threading-technology.html? wapkw=hyper+threading for more information including details on which processors support Intel(R) HT Technology. Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel(R) Turbo Boost Technology. See www.intel.com/technology/turboboost/ for more information. The Recommended Customer Price ("RCP") is pricing guidance for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice. Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP does not constitute a formal pricing offer from Intel. Please work with your appropriate Intel representative to obtain a formal price quotation. System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used. Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment. For benchmarking data see http://www.intel.com/performance. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details. Processors that support 64-bit computing on Intel(R) architecture require an Intel 64 architecture-enabled BIOS. Company Information Newsroom Our Commitment Communities Investor Relations Contact Us Jobs (c) Intel Corporation Terms of Use *Trademarks Privacy Cookies Supply Chain Transparency Site Map